 GOLD
COMPOUNDS |
| |
 |
GPC (Gold Potassium
Cyanide) K[Au(CN)2] |
| |
68.30% gold content,
used for electroplating and electroless
plating of gold |
|
TGPC (Tri-valent
Gold Potassium Cyanide) K[Au(CN)4] |
| |
57.8% gold content,
used for direct plating of gold
on stainless steel |
| |
|
|
 SILVER
COMPOUNDS |
| |
|
SPC (Silver Potassium
Cyanide) K[Ag(CN)2] |
| |
54% silver content |
|
SC (Silver Cyanide)
AgCN |
| |
80% silver content |
| |
SN (Silver Nitrate)
AgNO3 |
| |
63.5% silver content |
|
|
|
 PALLADIUM
COMPOUNDS |
| |
|
Palladium Diammine
Dichloride [Pd(NH3)2C12] |
| |
50% polladium content |
|
Polladium Chloride
[PdC12] |
| |
60% polladium content |
| |
|
|
| OTHERS |
| |
|
Gold targets |
|
Gold wires for
PVD |
| |
Physical Vapour
Deposition |
|
Silver Andose available
in various sizes |
|
Gold and silver
pellets, sheets, wires, plates
and granules |
|
| |
|
